High-density semiconductor dispenser nozzle "Pinpoint Nozzle"
This is a cutting-edge dispenser nozzle utilizing micro-drilling technology, thin-walled processing technology, and precision machining technology.
A high-precision dispensing nozzle specifically designed for "narrower" and "deeper" pinpoint applications in high-density semiconductors with densely arranged parts. This is the most advanced dispenser nozzle created by Tekudai, set to launch in the fall of 2024. ◆ An ultra-fine tip with a thickness of 0.02mm, optimal for "narrower" points Utilizing advanced thin-wall processing technology, the difference between inner and outer diameters is controlled to the extreme (thickness of 0.02mm). It can reach into the narrow gaps of high-density semiconductors. ◆ A 2mm long tip that reaches "deeper" points The length of the nozzle tip has been doubled from the conventional 1mm to 2mm. This allows for precise dispensing at deep points, such as between components. Additionally, our unique integrated processing achieves high-precision dispensing, unlike the press-fit method.
- Company：テクダイヤ
- Price：Other
